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 FK7SM-12
High-Speed Switching Use Nch Power MOS FET
REJ03G1378-0200 (Previous: MEJ02G0238-0101) Rev.2.00 Jul 07, 2006
Features
* * * * VDSS : 600 V rDS (ON) (max) : 1.63 ID : 7 A Integrated Fast Recovery Diode (MAX.) : 150 ns
Outline
RENESAS Package code: PRSS0004ZB-A (Package name: TO-3P)
2, 4 4
1
1. 2. 3. 4.
Gate Drain Source Drain
1
2
3 3
Applications
Servo motor drive, Robot, UPS, Lamp ballast, etc.
Maximum Ratings
(Tc = 25C)
Parameter Drain-source voltage Gate-source voltage Drain current Drain current (Pulsed) Source current Source current (Pulsed) Maximum power dissipation Channel temperature Storage temperature Mass Symbol VDSS VGSS ID IDM IS ISM PD Tch Tstg -- Ratings 600 30 7 21 7 21 125 - 55 to +150 - 55 to +150 4.8 Unit V V A A A A W C C g Conditions VGS = 0 V VDS = 0 V
Typical value
Rev.2.00
Jul 07, 2006
page 1 of 6
FK7SM-12
Electrical Characteristics
(Tch = 25C)
Parameter Drain-source breakdown voltage Gate-source breakdown voltage Gate-source leakage current Drain-source leakage current Gate-source threshold voltage Drain-source on-state resistance Drain-source on-state voltage Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Source-drain voltage Thermal resistance Reverse recovery time Symbol V(BR) DSS V(BR) GSS IGSS IDSS VGS (th) rDS (ON) VDS (ON) | yfs | Ciss Coss Crss td (on) tr td (off) tf VSD Rth(ch-c) trr Min. 600 30 -- -- 2 -- -- 3.3 -- -- -- -- -- -- -- -- -- -- Typ. -- -- -- -- 3 1.25 3.75 5.5 1100 125 17 30 30 100 35 1.5 -- -- Max. -- -- 10 1 4 1.63 4.89 -- -- -- -- -- -- -- -- 2.0 1.00 150 Unit V V A mA V V S pF pF pF ns ns ns ns V C/W ns Test conditions ID = 1 mA, VGS = 0 V IG = 100 A, VDS = 0 V VGS = 25 V, VDS = 0 V VDS = 600 V, VGS = 0 V ID = 1 mA, VDS = 10 V ID = 3 A, VGS = 10 V ID = 3 A, VGS = 10 V ID = 3 A, VDS = 10 V VDS = 25 V, VGS = 0 V, f = 1 MHz VDD = 200 V, ID = 3 A, VGS = 10 V, RGEN = RGS = 50 IS = 3 A, VGS = 0 V Channel to case IS = 7 A, dis/dt = -100 A/s
Performance Curves
Power Dissipation Derating Curve
200
5 3 2
Maximum Safe Operating Area
Power Dissipation PD (W)
tw=10s 100s
Drain Current ID (A)
160
120
101 7 5 3 2 100 7 5 3 2
80
40
0
0
50
100
150
200
10-1 7 5 100 2 3 5 7 101 2 3 5 7 102 2 3 5 7 103
Tc = 25C Single Pulse
DC
Case Temperature Tc (C)
Drain-Source Voltage VDS (V)
Rev.2.00
Jul 07, 2006
page 2 of 6
FK7SM-12
Output Characteristics (Typical)
20
Output Characteristics (Typical)
10
Tc = 25C Pulse Test
Drain Current ID (A)
Drain Current ID (A)
16
VGS = 20V 10V 6V
Tc = 25C Pulse Test
8
VGS = 20V 10V 6V
12
6
PD = 125W
5V
8
5V
4
4
PD = 125W
4V
2 4V
0
0
10
20
30
40
50
0
0
4
8
12
16
20
Drain-Source Voltage VDS (V)
Drain-Source Voltage VDS (V)
Drain-Source On-State Resistance rDS(ON) ()
Drain-Source On-State Voltage VDS(ON) (V)
On-State Voltage vs. Gate-Source Voltage (Typical)
40
On-State Resistance vs. Drain Current (Typical)
5.0
Tc = 25C Pulse Test
32 ID = 14A
Tc = 25C Pulse Test
4.0
24
3.0
VGS = 10V 20V
16 7A 8 3A
2.0
1.0 0 10-1 2 3 5 7 100 2 3 5 7 101 2 3 5 7 102
0
0
4
8
12
16
20
Gate-Source Voltage VGS (V)
Drain Current ID (A) Forward Transfer Admittance vs. Drain Current (Typical)
Forward Transfer Admittance | yfs | (S)
101 7 5 3 2 100 7 5 3 2 10-1 -1 10 23 5 7 100 23 5 7 101
Transfer Characteristics (Typical)
20
Drain Current ID (A)
16
Tc = 25C VDS = 50V Pulse Test
VDS = 10V Pulse Test
Tc = 25C
12
75C 125C
8
4
0
0
4
8
12
16
20
Gate-Source Voltage VGS (V)
Drain Current ID (A)
Rev.2.00
Jul 07, 2006
page 3 of 6
FK7SM-12
Capacitance vs. Drain-Source Voltage (Typical)
2 103 7 5 3 2 102 7 5 3 2
Coss
Switching Characteristics (Typical)
103 7 5
Ciss
Capacitance C (pF)
Switching Time (ns)
3 2 102 7 5 3 2 101 10-1 23
Tch = 25C VDD = 200V VGS = 10V RGEN = RGS = 50
td(off)
tf tr td(on)
Tch = 25C 101 f = 1MHz 7 VGS = 0V 5 2 3 5 7 100 2 3 5 7 101 2 3 5 7 102 2 3
Crss
5 7 100
23
5 7 101
Drain-Source Voltage VDS (V)
Drain Current ID (A)
Gate-Source Voltage vs. Gate Charge (Typical)
20
40
Source-Drain Diode Forward Characteristics (Typical)
VGS = 0V Pulse Test
Gate-Source Voltage VGS (V)
Tch = 25C ID = 7 A
16
VDS = 100V
200V
Source Current IS (A)
32
12
400V
24
Tc = 125C
8
16
75C
8
4
25C
0
0
20
40
60
80
100
0
0
0.8
1.6
2.4
3.2
4.0
Gate Charge Qg (nC) On-State Resistance vs. Channel Temperature (Typical)
101 7 5 3 2 100 7 5 3 2 10-1 0 50 100 150 200 250
Source-Drain Voltage VSD (V) Threshold Voltage vs. Channel Temperature (Typical)
5.0
Drain-Source On-State Resistance rDS(ON) (25C)
Drain-Source On-State Resistance rDS(ON) (tC)
Gate-Source Threshold Voltage VGS(th) (V)
VGS = 10V ID = 3A Pulse Test
VDS = 10V ID = 1mA
4.0
3.0
2.0
1.0
0
-50
0
50
100
150
Channel Temperature Tch (C)
Channel Temperature Tch (C)
Rev.2.00
Jul 07, 2006
page 4 of 6
FK7SM-12
Breakdown Voltage vs. Channel Temperature (Typical)
1.4
Drain-Source Breakdown Voltage V(BR)DSS (tC) Drain-Source Breakdown Voltage V(BR)DSS (25C)
Diode Reverse vs. Source Currnet Characteristic (Typical)
Reverce Recovery Current Irr (ns) Reverce Recovery Time trr (ns)
103 7 5 3 2 102 trr 7 5 3 2 101 0 10 Irr 102 dis/dt = -100A/s 7 VGS = 0V 5 VDD = 250V 3 2 101 7 5 3 2
VGS = 0V ID = 1mA
1.2
1.0
0.8
0.6
0.4
-50
0
50
100
150
23
5 7 101
Tch = 25C Tch = 150C 100 23 5 7 102
Channel Temperature Tch (C)
Source Current IS (A)
Transient Thermal Impedance Zth(ch-c) (C/W)
Diode Reverse vs. Source Currnet dis/dt Characteristic (Typical)
Reverce Recovery Current Irr (ns)
5
Transient Thermal Impedance Characteristics
101 7 5 3 2 100 7 5 3 2 10-1 7 5 3 2 0.05 0.02 0.01 D=1 0.5 0.2 0.1 PDM
tw T D= tw T
Reverce Recovery Time trr (ns)
3 2 trr 102 7 5 3 2 101 7 5 101
5 IS = 7A VGS = 0V 3 VDD = 250V 2 101 7 5 3 2 100 Tch = 25C Tch = 150C 7 5 23 5 7 103
Irr
23
57
102
Single Pulse 10-2 -42 3 5710-32 3 5710-22 3 5710-12 3 57100 2 3 57101 2 3 57102 10
Source Current dis/dt (-A/s)
Pulse Width tw (s)
Switching Time Measurement Circuit
Vin Monitor D.U.T. RL Vin Vout RGS VDD Vout Monitor
Switching Waveform
90%
RGEN
10% 10% 10%
90% td(on) tr
90% td(off) tf
Rev.2.00
Jul 07, 2006
page 5 of 6
FK7SM-12
Package Dimensions
Package Name TO-3P*
JEITA Package Code SC-65
RENESAS Code PRSS0004ZB-A
Previous Code
MASS[Typ.] 4.8g
Unit: mm
15.9Max
4.5 1.5
5.0 3.2 2
2
4
20.0
4.4
1.0
19.5Min
0.6 5.45 5.45
2.8
4
Ordering Information
Lead form Straight type Standard packing Static electricity prevention bag Quantity 200 Standard order code Type name Standard order code example FK7SM-12
Note: Please confirm the specification about the shipping in detail.
Rev.2.00
Jul 07, 2006
page 6 of 6
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120 Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
http://www.renesas.com
Renesas Technology Malaysia Sdn. Bhd Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510
(c) 2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .6.0


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